The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 23, 2021

Filed:

Feb. 06, 2018
Applicant:

Carnegie Mellon University, Pittsburgh, PA (US);

Inventors:

Alexandros Charalambides, Pittsburgh, PA (US);

Carmel Majidi, Pittsburgh, PA (US);

Assignee:

CARNEGIE MELLON UNIVERSITY, Pittsburgh, PA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/09 (2006.01); H05K 1/18 (2006.01); H05K 3/00 (2006.01); H05K 3/10 (2006.01); H05K 3/34 (2006.01); H05K 3/40 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0277 (2013.01); H05K 1/09 (2013.01); H05K 1/185 (2013.01); H05K 3/0014 (2013.01); H05K 3/107 (2013.01); H05K 3/34 (2013.01); H05K 3/4038 (2013.01); H05K 3/4644 (2013.01); H05K 2201/0215 (2013.01); H05K 2201/0329 (2013.01);
Abstract

According to one embodiment is a flexible circuit comprising a flexible base, a conductive polymer supported by the base, and an integrated circuit component having an elongated electrical contact, wherein the elongated electrical contact penetrates into the conductive polymer, thereby providing a robust electrical connection. According to methods of certain embodiments, the flexible circuit is manufactured using a molding process, where a conductive polymer is deposited into recesses in a mold, integrated circuit components are placed in contact with the conductive polymer, and a flexible polymer base is poured over the mold prior to curing. In an alternative embodiment, a multiple-layer flexible circuit is manufacturing using a plurality of molds.


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