The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 23, 2021
Filed:
Jun. 21, 2019
Applicant:
Mitsubishi Electric Corporation, Tokyo, JP;
Inventors:
Nobuchika Aoki, Tokyo, JP;
Rei Yoneyama, Tokyo, JP;
Keisuke Eguchi, Tokyo, JP;
Hiroki Hidaka, Tokyo, JP;
Assignee:
Mitsubishi Electric Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H02H 7/122 (2006.01); H02H 1/00 (2006.01); H02M 5/458 (2006.01); H02M 1/08 (2006.01); H01L 25/18 (2006.01); H01L 25/065 (2006.01); H02M 1/00 (2006.01);
U.S. Cl.
CPC ...
H02H 7/122 (2013.01); H02H 1/0007 (2013.01); H02M 1/08 (2013.01); H02M 5/4585 (2013.01); H01L 25/0655 (2013.01); H01L 25/18 (2013.01); H02M 1/0009 (2021.05);
Abstract
A semiconductor module includes a diode bridge circuit, a sensor configured to measure a current value of the diode bridge circuit, a current limiting circuit having an IGBT connected to the diode bridge circuit, and a protection circuit configured to switch ON and OFF the IGBT in accordance with the current value of the diode bridge circuit measured by the sensor.