The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 23, 2021

Filed:

Sep. 28, 2018
Applicant:

Te Connectivity Corporation, Berwyn, PA (US);

Inventors:

John Joseph Consoli, Harrisburg, PA (US);

Rodney Ivan Martens, Mechanicsburg, PA (US);

Chad William Morgan, Carneys Point, NJ (US);

Suvrat Bhargava, Middletown, PA (US);

Assignee:

TE CONNECTIVITY SERVICES GmbH, Schaffhausen, CH;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 13/03 (2006.01); H01R 13/514 (2006.01); H01B 1/02 (2006.01); H01R 13/6471 (2011.01); H01R 13/6587 (2011.01); H01R 43/20 (2006.01); H05K 9/00 (2006.01); H05K 3/24 (2006.01);
U.S. Cl.
CPC ...
H01R 13/03 (2013.01); H01B 1/026 (2013.01); H01R 13/514 (2013.01); H01R 13/6471 (2013.01); H01R 13/6587 (2013.01); H01R 43/20 (2013.01); H05K 3/243 (2013.01); H05K 3/247 (2013.01); H05K 9/0084 (2013.01); H05K 9/0088 (2013.01); H05K 2201/0341 (2013.01);
Abstract

Electrical connector includes a housing, signal contacts, and ground shields. The signal contacts are coupled to the housing and positioned for mating with mating signal contacts of a mating connector. The ground shields are coupled to the housing and at least partially surround the signal contacts to shield the signal contacts. The ground shields are plated with a ground-material composition along one or more contact segments of the ground shields that come into compression engagement with one or more other conductive members. The ground-material composition includes a tin-nickel (Sn/Ni) alloy plating layer. The signal contacts are plated with a signal-material composition that is different than the ground-material composition.


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