The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 23, 2021

Filed:

May. 18, 2018
Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventors:

Kei Yokokawa, Tokyo, JP;

Narihiro Nakamoto, Tokyo, JP;

Toru Fukasawa, Tokyo, JP;

Tomohiro Takahashi, Tokyo, JP;

Masataka Otsuka, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 21/06 (2006.01); H01Q 21/00 (2006.01); H01Q 1/48 (2006.01); H01Q 9/04 (2006.01);
U.S. Cl.
CPC ...
H01Q 21/0075 (2013.01); H01Q 1/48 (2013.01); H01Q 9/0407 (2013.01); H01Q 21/065 (2013.01);
Abstract

Included are: a first dielectric substrate provided with a first conductor ground plane on a front or back surface thereof; a plurality of patch antennas formed in the first conductor ground plane, a plurality of conductive members, ends of which connected to the first conductor ground plane to surround the patch antennas individually, and a second conductor ground plane connected to each of the other ends of the conductive members, and parts of the plurality of conductive members penetrate the first dielectric substrate, and the remaining parts of the conductive members function as spacers for providing an air layer between the first dielectric substrate and the second conductor ground plane, and the plurality of conductive members functions as spacers for providing an air layer between the first conductor ground plane and the second conductor ground plane.


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