The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 23, 2021

Filed:

Feb. 20, 2020
Applicant:

Electronics and Telecommunications Research Institute, Daejeon, KR;

Inventors:

Doo-Hee Cho, Daejeon, KR;

Young-Sam Park, Daejeon, KR;

Byoung Gon Yu, Chungcheongbuk-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 51/00 (2006.01); H01L 27/32 (2006.01); H01L 51/52 (2006.01); H01L 27/12 (2006.01);
U.S. Cl.
CPC ...
H01L 51/0097 (2013.01); H01L 27/3248 (2013.01); H01L 27/3258 (2013.01); H01L 27/3276 (2013.01); H01L 51/5253 (2013.01); H01L 27/124 (2013.01); H01L 27/1218 (2013.01); H01L 27/1248 (2013.01); H01L 27/3288 (2013.01); H01L 2251/5338 (2013.01);
Abstract

Provided are a flexible electronic device including device units, a first etching preventing layer provided on the device units, a conductive line provided on the first etching preventing layer and electrically connected to the device units, a flexible substrate covering the conductive line on the first etching preventing layer and the conductive line, a trench separating the device units and exposing a portion of a bottom surface of the first etching preventing layer and a side surface of each of the device units, and a flexible protective layer conformally covering a bottom surface of each of the device units and an inside of the trench, wherein each of the device units includes a protective substrate, driving parts provided on the protective substrate, and a first encapsulation layer configured to cover the driving parts, and a manufacturing method thereof.


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