The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 23, 2021

Filed:

May. 28, 2019
Applicants:

Seoul Viosys Co., Ltd., Gyeonggi-do, KR;

Seoul Viosys Co., Ltd., Gyeonggi-do, KR;

Inventors:

Se Hee Oh, Gyeonggi-do, KR;

Hyun A Kim, Gyeonggi-do, KR;

Jong Kyu Kim, Gyeonggi-do, KR;

Jong Hyeon Chae, Gyeonggi-do, KR;

Assignee:

SEOUL VIOSYS CO., LTD., Gyeonggi-Do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/62 (2010.01); H01L 33/32 (2010.01); H01L 33/10 (2010.01); H01L 33/64 (2010.01); H01L 33/44 (2010.01); H01L 33/08 (2010.01); H01L 33/38 (2010.01); H01L 33/40 (2010.01); H01L 33/60 (2010.01); F21S 41/141 (2018.01); F21Y 115/10 (2016.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); H01L 33/08 (2013.01); H01L 33/10 (2013.01); H01L 33/32 (2013.01); H01L 33/382 (2013.01); H01L 33/405 (2013.01); H01L 33/44 (2013.01); H01L 33/60 (2013.01); H01L 33/64 (2013.01); F21S 41/141 (2018.01); F21Y 2115/10 (2016.08); H01L 2933/0066 (2013.01);
Abstract

A light emitting diode having a plurality of light emitting cells is provided. The light emitting diode according to an exemplary embodiment includes a lower insulation layer covering an ohmic reflection layer, connectors disposed on the lower insulation layer to connect the light emitting cells, and an upper insulation layer covering the connectors and the lower insulation layer. An edge of the lower insulation layer is spaced apart farther from an edge of the upper insulation layer than an edge of the light emitting cell. The lower insulation layer susceptible to moisture may be protected and reliability of the light emitting diode may improve.


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