The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 23, 2021

Filed:

Dec. 04, 2017
Applicant:

Renesas Electronics Corporation, Tokyo, JP;

Inventor:

Tatsuyoshi Mihara, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/8239 (2006.01); H01L 27/1157 (2017.01); H01L 29/792 (2006.01); H01L 29/78 (2006.01); H01L 21/3213 (2006.01); H01L 29/423 (2006.01); H01L 29/49 (2006.01); H01L 21/28 (2006.01); H01L 27/11568 (2017.01); H01L 27/11573 (2017.01); H01L 21/308 (2006.01); H01L 29/66 (2006.01); H01L 27/092 (2006.01); H01L 21/8238 (2006.01);
U.S. Cl.
CPC ...
H01L 27/1157 (2013.01); H01L 21/3086 (2013.01); H01L 21/32134 (2013.01); H01L 21/823821 (2013.01); H01L 27/0924 (2013.01); H01L 27/11568 (2013.01); H01L 27/11573 (2013.01); H01L 29/40117 (2019.08); H01L 29/42344 (2013.01); H01L 29/4933 (2013.01); H01L 29/66545 (2013.01); H01L 29/7851 (2013.01); H01L 29/7855 (2013.01); H01L 29/792 (2013.01);
Abstract

After a dummy control gate electrode and a memory gate electrode are formed and an interlayer insulating film is formed so as to cover the gate electrodes, the interlayer insulating film is polished to expose the dummy control gate electrode and the memory gate electrode. Thereafter, the dummy control gate electrode is removed by etching, and then a control gate electrode is formed in a trench which is a region from which the dummy control gate electrode has been removed. The dummy control gate electrode is made of a non-doped or n type silicon film, and the memory gate electrode is made of a p type silicon film. In the process of removing the dummy control gate electrode, the dummy control gate electrode is removed by performing etching under the condition that the memory gate electrode is less likely to be etched compared with the dummy control gate electrode, in the state where the dummy control gate electrode and the memory gate electrode are exposed.


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