The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 23, 2021
Filed:
Feb. 20, 2018
Applicant:
Skorpios Technologies, Inc., Albuquerque, NM (US);
Inventors:
Stephen B. Krasulick, Albuquerque, NM (US);
Timothy Creazzo, Albuquerque, NM (US);
Elton Marchena, Albuquerque, NM (US);
John Dallesasse, Geneva, IL (US);
Assignee:
Skorpios Technologies, Inc., Albuquerque, NM (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 25/00 (2006.01); G02B 6/00 (2006.01); H01L 21/48 (2006.01); H01L 21/74 (2006.01); H01L 21/84 (2006.01); G02B 6/13 (2006.01); H01L 21/8258 (2006.01); H01L 21/762 (2006.01); G02B 6/43 (2006.01); H01L 31/18 (2006.01); H01L 25/16 (2006.01); H01S 5/02 (2006.01); G02B 6/12 (2006.01); H01L 33/00 (2010.01); H01S 5/0234 (2021.01);
U.S. Cl.
CPC ...
H01L 25/50 (2013.01); G02B 6/00 (2013.01); G02B 6/13 (2013.01); G02B 6/43 (2013.01); H01L 21/4857 (2013.01); H01L 21/746 (2013.01); H01L 21/76251 (2013.01); H01L 21/76254 (2013.01); H01L 21/8258 (2013.01); H01L 21/84 (2013.01); H01L 31/18 (2013.01); G02B 2006/12061 (2013.01); H01L 25/167 (2013.01); H01L 33/0093 (2020.05); H01L 2224/04105 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/18 (2013.01); H01L 2224/73259 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/92244 (2013.01); H01L 2924/0002 (2013.01); H01S 5/021 (2013.01); H01S 5/0215 (2013.01); H01S 5/0234 (2021.01);
Abstract
Fabricating a multilevel composite semiconductor structure includes providing a first substrate comprising a first material; dicing a second substrate to provide a plurality of dies; mounting the plurality of dies on a third substrate; joining the first substrate and the third substrate to form a composite structure; and joining a fourth substrate and the composite structure.