The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 23, 2021
Filed:
Apr. 11, 2018
Applicant:
Audi Ag, Ingolstadt, DE;
Inventors:
Andreas Apelsmeier, Pollenfeld, DE;
Johann Asam, Adelzhausen, DE;
Assignee:
AUDI AG, Ingolstadt, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/11 (2006.01); H01L 23/492 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 25/112 (2013.01); H01L 23/492 (2013.01); H01L 23/49822 (2013.01); H01L 23/49833 (2013.01); H01L 24/29 (2013.01); H01L 24/48 (2013.01); H01L 2224/2612 (2013.01); H01L 2224/29582 (2013.01); H01L 2224/4824 (2013.01); H01L 2224/4826 (2013.01); H01L 2224/48155 (2013.01);
Abstract
A power electronics module includes a substrate with a substrate metallization layer, which is separated into conducting areas for providing conducting paths for the power electronics module; a semiconductor switch chip bonded with a first power electrode to a first conducting area of the substrate metallization layer; a conductor plate bonded to a second power electrode of the semiconductor switch chip opposite to the first power electrode.