The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 23, 2021

Filed:

Feb. 14, 2020
Applicant:

Kioxia Corporation, Minato-ku, JP;

Inventors:

Yusuke Akada, Yokohama, JP;

Rina Kadowaki, Koza Kanagawa, JP;

Hiroyuki Maeda, Kawasaki Kanagawa, JP;

Assignee:

Kioxia Corporation, Minato-ku, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/58 (2006.01); H01L 23/31 (2006.01); H01L 21/82 (2006.01);
U.S. Cl.
CPC ...
H01L 23/585 (2013.01); H01L 21/82 (2013.01); H01L 23/3171 (2013.01);
Abstract

A semiconductor device according to the present embedment includes a substrate having a first region provided with a semiconductor element and a second region provided from the first region to an end. A material film is provided above the first and second regions. A first metal film is provided on the material film in the second region or on the material film between the first region and the second region. A trench, which caves in toward the substrate from a surface of the material film in the first region and from a surface of the material film under the first metal film, is provided in the material film between the first metal film and the first region.


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