The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 23, 2021
Filed:
Jan. 17, 2020
Allegro Microsystems, Llc, Manchester, NH (US);
Shixi Louis Liu, Hooksett, NH (US);
Natasha Healey, Bedford, NH (US);
Rishikesh Nikam, Manchester, NH (US);
Allegro MicroSystems, LLC, Manchester, NH (US);
Abstract
A power integrated circuit (IC) includes a lead frame comprising a signal lead, a power lead, and a paddle attached to one or more of the signal lead and the power lead, an electrical component supported by the paddle, and a mold material configured to enclose a portion of the lead frame and expose a surface of the paddle, wherein the power lead has a first portion extending from an edge of the mold material outside of the mold material in a first direction and a second portion enclosed by the mold material and extending from the edge of the mold material inside the mold material in a second direction to the paddle, wherein the second direction is substantially opposite to the first direction. In embodiments, the paddle is only attached to the second portion of the power lead. The first and second portions of the power lead meet at a junction between a first portion of the mold material and a second portion of the mold material, the junction positioned on a side surface of the mold material that extends from a first surface to a substantially parallel second surface of the mold material.