The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 23, 2021

Filed:

Jul. 18, 2017
Applicant:

Shoei Chemical Inc., Tokyo, JP;

Inventors:

Hayato Tateno, Tosu, JP;

Junichi Ikuno, Tosu, JP;

Hiroshi Mashima, Tosu, JP;

Assignee:

SHOEI CHEMICAL INC., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B 1/22 (2006.01); C03C 8/04 (2006.01); C03C 8/18 (2006.01);
U.S. Cl.
CPC ...
H01B 1/22 (2013.01); C03C 8/04 (2013.01); C03C 8/18 (2013.01);
Abstract

A conductive paste comprising a conductive powder, a glass frit substantially free of lead, and an organic vehicle, wherein the glass frit contains 25 to 50 mol % B in terms of BO, 25 to 50 mol % Si in terms of SiO, 7 to 23 mol % Al in terms of AlO, 2 to 15 mol % Mg in terms of MgO, 2 to 5 mol % Ba in terms of BaO, one or two selected from the group consisting of 3 to 18 mol % Zn in terms of ZnO, and 3 to 8 mol % Ti in terms of TiO, based on the total number of moles in terms of the above oxides. According to the present invention, it is possible to provide a lead-free conductive paste having excellent resistance to dissolution in solder and acid resistance as well as being capable of forming fired films having excellent adherence and adhesion to a substrate.


Find Patent Forward Citations

Loading…