The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 23, 2021
Filed:
Jul. 29, 2019
Applicant:
Seagate Technology Llc, Cupertino, CA (US);
Inventors:
Tong Zhao, Eden Prairie, MN (US);
Li Wan, Eden Prairie, MN (US);
Michael Christopher Kautzky, Eagan, MN (US);
Assignee:
Seagate Technology LLC, Fremont, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11B 5/31 (2006.01); G11B 5/73 (2006.01); H01F 10/30 (2006.01); G11B 5/66 (2006.01); B32B 7/022 (2019.01); B82B 1/00 (2006.01); B82Y 10/00 (2011.01);
U.S. Cl.
CPC ...
G11B 5/739 (2019.05); B32B 7/022 (2019.01); B82B 1/003 (2013.01); G11B 5/3133 (2013.01); G11B 5/66 (2013.01); H01F 10/30 (2013.01); B82Y 10/00 (2013.01);
Abstract
A thin film structure (e.g., a near-field transducer), includes a first surface parallel to a substrate on which the thin film structure is deposited and two other surfaces orthogonal to the first surface. The first surface and the two other surfaces have respective first, second, and third selected plane orientations with respective first, second, and third atomic packing factors. The first, second, and third selected plane orientations are selected to maximize an average of the first, second, and third atomic packing factors.