The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 23, 2021

Filed:

Jun. 28, 2019
Applicant:

General Electric Company, Schenectady, NY (US);

Inventors:

Sathyanarayanan Raghavan, Niskayuna, NY (US);

Ananda Barua, Schnectady, NY (US);

Prabhjot Singh, Guilderland, NY (US);

Arvind Rangarajan, San Ramon, CA (US);

Changjie Sun, Schnectady, NY (US);

Dean Robinson, Niskayuna, NY (US);

Assignee:

General Electric Company, Schenectady, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 30/20 (2020.01); B29C 64/393 (2017.01); B29C 64/40 (2017.01); B33Y 40/00 (2020.01); B33Y 50/02 (2015.01); G06F 119/08 (2020.01); G06F 119/18 (2020.01);
U.S. Cl.
CPC ...
G06F 30/20 (2020.01); B29C 64/393 (2017.08); B29C 64/40 (2017.08); B33Y 40/00 (2014.12); B33Y 50/02 (2014.12); G06F 2119/08 (2020.01); G06F 2119/18 (2020.01);
Abstract

A method, medium, and system to execute an additive manufacturing (AM) simulation on a model of a part; determine, based on the AM simulation, a prediction of a temperature and displacement distribution in the part at a particular time in the AM process; apply the predicted temperature and displacement distributions in the part as a boundary conditions on a support design space to determine a temperature distribution throughout the support design space; and execute a thermal-structural topology optimization based on the determined temperature and displacement distributions throughout the support design space to determine a distribution of material in the design space for a thermal support structure to interface with the part that optimally reduces a thermal gradient in the part with a minimum of material and results in the generation of an optimized AM support structure.


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