The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 23, 2021

Filed:

Dec. 07, 2020
Applicant:

Dongwoo Fine-chem Co., Ltd., Jeollabuk-do, KR;

Inventors:

Hye Rim Kwon, Incheon, KR;

Sung Woo Yu, Gyeonggi-do, KR;

Dong Jin Son, Chungcheongnam-do, KR;

Jin Woo Lee, Seoul, KR;

Assignee:

DONGWOO FINE-CHEM CO., LTD., Jeollabuk-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 3/044 (2006.01); G06F 3/041 (2006.01); G02F 1/1333 (2006.01); H01L 27/32 (2006.01);
U.S. Cl.
CPC ...
G06F 3/0443 (2019.05); G06F 3/04164 (2019.05); G02F 1/13338 (2013.01); G06F 3/0446 (2019.05); G06F 2203/04102 (2013.01); G06F 2203/04103 (2013.01); G06F 2203/04111 (2013.01); H01L 27/323 (2013.01);
Abstract

A touch sensor module according to an embodiment of the present invention includes a touch sensor layer including sensing electrodes and traces branching from the sensing electrodes, a flexible circuit board electrically connected to the traces at one end portion of the touch sensor layer, and a supporting structure commonly and partially covering the flexible circuit board and the touch sensor layer. Damages and delamination of electrodes and wirings included in the flexible circuit board and the touch sensor layer is prevented by the supporting structure.


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