The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 23, 2021

Filed:

Dec. 17, 2019
Applicant:

Shenzhen Tcl New Technology Co., Ltd., Shenzhen, CN;

Inventors:

Zelong Li, Shenzhen, CN;

Daiqing Wang, Shenzhen, CN;

Kewen Qiang, Shenzhen, CN;

Honglei Ji, Shenzhen, CN;

Assignee:

Other;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02F 1/13357 (2006.01); G02F 1/1335 (2006.01); H01L 33/50 (2010.01); H01L 33/60 (2010.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
G02F 1/133603 (2013.01); G02F 1/133605 (2013.01); G02F 1/133607 (2021.01); G02F 1/133612 (2021.01); H01L 33/504 (2013.01); H01L 33/60 (2013.01); H01L 33/62 (2013.01);
Abstract

A backlight module. The backlight module comprises: an LED chip (), a transparent support (), and a packaging adhesive (); an accommodating groove () is provided on the transparent support (), and the LED chip () is provided at the bottom of the accommodating groove (); the packaging adhesive () is located in the accommodating groove () and covers a light-exiting surface of the LED chip (). The LED chip () and the packaging adhesive () are provided in the accommodating groove (), so that the transparent support () and the packaging adhesive () enlarge a light-exiting angle of the LED chip (), thereby reducing the number of the LED chips () in the backlight module and reducing the production costs.


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