The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 23, 2021

Filed:

Jul. 30, 2020
Applicant:

Denso Corporation, Kariya, JP;

Inventors:

Junichi Hasegawa, Kariya, JP;

Yusuke Michishita, Kariya, JP;

Assignee:

DENSO CORPORATION, Kariya, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 31/62 (2020.01); G01R 31/28 (2006.01); H01L 23/31 (2006.01); H01L 23/495 (2006.01); H01L 23/64 (2006.01);
U.S. Cl.
CPC ...
G01R 31/62 (2020.01); G01R 31/2884 (2013.01); H01L 23/3107 (2013.01); H01L 23/4952 (2013.01); H01L 23/49503 (2013.01); H01L 23/49575 (2013.01); H01L 23/645 (2013.01);
Abstract

A semiconductor device includes: a signal input circuit that receives a signal from an outside; a signal output circuit that outputs the signal to the outside; a coupling element connected between the signal input circuit and the signal output circuit; an inspection output circuit that causes the signal input circuit to output an inspection signal to the outside not via the coupling element or an inspection input circuit that causes the signal output circuit to receive the inspection signal from the outside not via the coupling element. The signal input circuit, the signal output circuit, and the coupling element are formed on a semiconductor chip and packaged.


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