The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 23, 2021

Filed:

Feb. 24, 2019
Applicant:

University of Electronic Science and Technology of China, Chengdu, CN;

Inventors:

Bowan Tao, Chengdu, CN;

Jie Xiong, Chengdu, CN;

Fei Zhang, Chengdu, CN;

Chaoren Li, Chengdu, CN;

Xiaohui Zhao, Chengdu, CN;

Yanrong Li, Chengdu, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/46 (2006.01); C23C 16/54 (2006.01); C23C 16/40 (2006.01); C23C 14/54 (2006.01); C23C 16/56 (2006.01); C23C 14/08 (2006.01); C23C 14/24 (2006.01); C23C 14/56 (2006.01); C23C 14/00 (2006.01);
U.S. Cl.
CPC ...
C23C 16/46 (2013.01); C23C 14/00 (2013.01); C23C 14/08 (2013.01); C23C 14/24 (2013.01); C23C 14/541 (2013.01); C23C 14/562 (2013.01); C23C 16/40 (2013.01); C23C 16/545 (2013.01); C23C 16/56 (2013.01);
Abstract

The invention provides a thin film deposition system and a method, and relates to the field of thin film deposition. The deposition method comprises the following steps: 1) heating metal substrate; carrying out deposition. The method is characterized in the step 1) that a current is conducted into the metal substrate at one end of the growth zone by one electrode, and out of the metal substrate at the other end of the growth zone by the other electrode, so that the metal substrate is heated by the heat emitting of the resistant of the metal substrate itself. According to the method, the quality of the prepared thin film is improved, while the preparation cost of the thin film is reduced. In addition, the consistent double-sided thin films can be easily prepared on two surfaces of the metal substrate by employing the system and method.


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