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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11180593 B1

PDFFull Text
Date of Patent:
Nov. 23, 2021

Filed:

Apr. 17, 2019

Methacrylic resin composition for non-contact hot plate welding, molded article, and method for producing same

Applicant:

Asahi Kasei Kabushiki Kaisha, Tokyo, JP;

Inventors:

Masahiro Watanabe, Tokyo, JP;

Katsura Tsujimoto, Tokyo, JP;

Kazunori Kozawa, Tokyo, JP;

Assignee:

ASAHI KASEI KABUSHIKI KAISHA, Tokyo, JP;

Attorney:

Birch, Stewart, Kolasch & Birch, LLP

Primary Examiner:

Michael M Bernshteyn

Int. Cl.
CPC ...
C08F 220/14 (2006.01); C08F 220/10 (2006.01); C08L 33/10 (2006.01); B29C 65/14 (2006.01); B29C 65/20 (2006.01); B29C 65/16 (2006.01); B29C 65/06 (2006.01); B29C 65/82 (2006.01); B29C 65/00 (2006.01); B29L 31/00 (2006.01); B29L 31/30 (2006.01); B29K 33/00 (2006.01); B29K 55/02 (2006.01); B29K 105/00 (2006.01);
U.S. Cl.
CPC ...
C08F 220/14 (2013.01); B29C 65/1412 (2013.01); B29C 65/1432 (2013.01); B29C 65/20 (2013.01); B29C 65/8253 (2013.01); B29C 66/342 (2013.01); B29C 66/71 (2013.01); B29C 66/712 (2013.01); B29C 66/73365 (2013.01); B29C 66/73921 (2013.01); C08F 220/10 (2013.01); C08L 33/10 (2013.01); B29C 65/06 (2013.01); B29C 65/16 (2013.01); B29K 2033/12 (2013.01); B29K 2055/02 (2013.01); B29K 2105/0094 (2013.01); B29K 2995/0088 (2013.01); B29L 2031/30 (2013.01); B29L 2031/3008 (2013.01); B29L 2031/747 (2013.01);
Abstract

The present invention provides a methacrylic resin composition for non-contact hot plate welding comprising a methacrylic resin comprising 80 to 99.9% by mass of a methacrylic acid ester monomer unit and 0.1 to 20% by mass of a unit of at least one additional vinyl monomer copolymerizable with the methacrylic acid ester monomer, wherein the methacrylic resin composition has a melt flow rate (MFR) of 2.5 g/10 min or lower at 230° C. at a load of 3.8 kg.

Find Patent Forward Citations

Watanabe, Masahiro. (2021). Methacrylic resin composition for non-contact hot plate welding, molded article, and method for producing same (U.S. Patent No. 11180593). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11180593

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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