The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 23, 2021

Filed:

Sep. 12, 2018
Applicant:

Seiko Epson Corporation, Tokyo, JP;

Inventor:

Hajime Nakao, Azumino, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/14 (2006.01); H01L 41/053 (2006.01); H01L 41/09 (2006.01); H01L 41/04 (2006.01); H01L 41/08 (2006.01); H01L 41/047 (2006.01);
U.S. Cl.
CPC ...
B41J 2/14233 (2013.01); B41J 2/1433 (2013.01); H01L 41/042 (2013.01); H01L 41/0471 (2013.01); H01L 41/053 (2013.01); H01L 41/0815 (2013.01); H01L 41/09 (2013.01); B41J 2002/14241 (2013.01); B41J 2002/14362 (2013.01); B41J 2002/14419 (2013.01); B41J 2002/14491 (2013.01);
Abstract

A liquid ejecting head includes a flow path forming substrate, a vibration plate that is formed on one surface side of the flow path forming substrate, a first piezoelectric element that is provided on the vibration plate, a second piezoelectric element that is provided on the vibration plate, a protective substrate that is bonded to the one surface side of the flow path forming substrate, a flow path member that is adhered to a side of the protective substrate opposite to the flow path forming substrate via an adhesive, and a drive circuit that is mounted in a space formed so as to be surrounded by the flow path forming substrate, the protective substrate, and the flow path member, in which the flow path member is provided with a hole portion which is open to a region facing the space.


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