The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11179933 B1

PDF
Full Text
Expired
Date of Patent:
Nov. 23, 2021

Filed:

Nov. 15, 2019
Applicant:

Hp Scitex Ltd., Netanya, IL;

Inventors:

Ken Vandenberghe, Corvallis, OR (US);

Alon Navon, Azour, IL;

Ronny Tuttnauer, Netanya, IL;

Assignee:

HP SCITEX LTD., Netanya, IL;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/14 (2006.01); B41J 25/34 (2006.01); B41J 2/16 (2006.01); B41J 2/045 (2006.01); B41J 25/00 (2006.01);
U.S. Cl.
CPC ...
B41J 2/14 (2013.01); B41J 2/04505 (2013.01); B41J 2/04506 (2013.01); B41J 2/04581 (2013.01); B41J 2/14201 (2013.01); B41J 2/1604 (2013.01); B41J 25/001 (2013.01); B41J 25/34 (2013.01); B41J 2002/14379 (2013.01); B41J 2202/19 (2013.01);
Abstract

A method may include positioning first and second printhead die within a die carrier, using a registration pin of the die carrier to align the first and second printhead die and fixing the position of the first and second printhead die within the die carrier.


Find Patent Forward Citations

Vandenberghe, Ken. (2021). Printhead die assembly (U.S. Patent No. 11179933). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11179933

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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