The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 23, 2021

Filed:

Apr. 04, 2019
Applicant:

Agc Inc., Chiyoda-ku, JP;

Inventor:

Motoshi Ono, Tokyo, JP;

Assignee:

AGC INC., Chiyoda-ku, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C03C 15/00 (2006.01); B23K 26/362 (2014.01); C03B 25/02 (2006.01); B23K 26/08 (2014.01); B23K 26/402 (2014.01); B23K 26/60 (2014.01); H01L 21/48 (2006.01); B23K 26/382 (2014.01); B23K 26/70 (2014.01); H01L 23/15 (2006.01); B23K 103/00 (2006.01);
U.S. Cl.
CPC ...
B23K 26/362 (2013.01); B23K 26/0853 (2013.01); B23K 26/382 (2015.10); B23K 26/402 (2013.01); B23K 26/60 (2015.10); B23K 26/702 (2015.10); C03B 25/02 (2013.01); C03C 15/00 (2013.01); H01L 21/486 (2013.01); B23K 2103/54 (2018.08); H01L 23/15 (2013.01);
Abstract

A manufacturing method of a glass substrate having holes includes irradiating a plurality of hole formation target positions of a dummy glass substrate with a laser under a first condition, to form a plurality of holes in the dummy glass substrate; heating the dummy glass substrate under a second condition; measuring, for each of the hole formation target positions, a deviation between the hole formation target position and a position of the hole after the heating formed by irradiating the hole formation target position of the dummy glass substrate; irradiating irradiation target positions of a glass substrate, having substantially same shape, dimension and composition as the dummy glass substrate, with a laser under the first condition, to form a plurality of holes, the irradiation target positions of the glass substrate with the laser being determined taking into account the deviation; and heating the glass substrate under the second condition.


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