The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 23, 2021
Filed:
Oct. 07, 2016
Hewlett-packard Development Company, L.p., Spring, TX (US);
Manish Giri, Corvallis, OR (US);
Chantelle Domingue, Corvallis, OR (US);
Tod Woodford, Corvallis, OR (US);
Matthew David Smith, Corvallis, OR (US);
Rachel M. White, Corvallis, OR (US);
Joshua M. Yu, Corvallis, OR (US);
Hilary Ely, Corvallis, OR (US);
Jeremy Sells, Corvallis, OR (US);
Hewlett-Packard Development Company, L.P., Spring, TX (US);
Abstract
The present disclosure is drawn to microfluidic chips. The microfluidic chips can include an inflexible material having an elastic modulus of 0.1 gigapascals (GPa) to 450 GPa. A microfluidic channel can be formed within the inflexible material and can connect an inlet and an outlet. A working electrode can be associated with the microfluidic channel and can have a surface area of 1 μmto 60,000 μmwithin the microfluidic channel. A bubble support structure can also be formed within the microfluidic channel such that the working electrode is positioned to electrolytically generate a bubble that becomes associated with the bubble support structure.