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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11178786 B1

PDFFull Text
Date of Patent:
Nov. 16, 2021

Filed:

Jun. 06, 2019

Method for manufacturing hermetic sealing lid member

Applicant:

Hitachi Metals, Ltd., Tokyo, JP;

Inventors:

Masayuki Yokota, Suita, JP;

Masaharu Yamamoto, Suita, JP;

Assignee:

HITACHI METALS, LTD., Tokyo, JP;

Attorney:

Westerman, Hattori, Daniels & Adrian, LLP

Primary Examiner:

Kiley S Stoner

Int. Cl.
CPC ...
B23K 20/00 (2006.01); H05K 5/06 (2006.01); B23K 20/04 (2006.01); B23K 1/00 (2006.01); B23K 1/20 (2006.01); H01L 21/48 (2006.01); H01L 23/06 (2006.01); H01L 41/053 (2006.01); H01L 41/23 (2013.01); H03H 9/10 (2006.01); H05K 5/03 (2006.01); B23K 101/40 (2006.01); B32B 15/01 (2006.01); B23K 35/30 (2006.01);
U.S. Cl.
CPC ...
H05K 5/066 (2013.01); B23K 1/00 (2013.01); B23K 1/0016 (2013.01); B23K 1/20 (2013.01); B23K 20/04 (2013.01); H01L 21/4817 (2013.01); H01L 23/06 (2013.01); H01L 41/0533 (2013.01); H01L 41/23 (2013.01); H03H 9/10 (2013.01); H05K 5/03 (2013.01); B23K 35/3006 (2013.01); B23K 2101/40 (2018.08); B32B 15/015 (2013.01); H01L 2224/16 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/16152 (2013.01); H03H 9/1021 (2013.01); Y10T 428/12896 (2015.01); Y10T 428/12951 (2015.01);
Abstract

The method manufactures a hermetic sealing lid member used for an electronic component housing package including an electronic component arrangement member on which an electronic component is arranged. The method includes forming a clad material in which a silver brazing layer that contains Ag and Cu and a first Fe layer arranged on the silver brazing layer and made of Fe or an Fe alloy are bonded to each other by roll-bonding a silver brazing plate that contains Ag and Cu and a first Fe plate made of Fe or an Fe alloy to each other and performing first heat treatment for diffusion annealing; softening the clad material by performing second heat treatment; and forming the hermetic sealing lid member in a box shape including a recess portion by bending the softened clad material.

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