The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 16, 2021
Filed:
Dec. 27, 2019
Murata Manufacturing Co., Ltd., Kyoto, JP;
Tadashi Nomura, Kyoto, JP;
Yuta Morimoto, Kyoto, JP;
Minoru Komiyama, Kyoto, JP;
Akio Katsube, Kyoto, JP;
MURATA MANUFACTURING CO., LTD., Kyoto, JP;
Abstract
A high frequency moduleincludes a wiring board, multiple componentstomounted on an upper surfaceof the wiring board, a shield componentmounted between the componentand the component, a sealing resin layerthat covers the componentstoand the shield component, and a shield filmthat covers the surface of the sealing resin layer. A recessis formed in an upper surfaceof the sealing resin layerso as to expose the shield component. The recessis formed within a region surrounded by edges of the sealing resin layerso as not to reach the side surfaces of the sealing resin layer. The shield filmfurther covers wall surfacesof the recessand part of the shield componentexposed through the recess