The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 16, 2021
Filed:
Oct. 29, 2020
Applicant:
Fuji Electric Co., Ltd., Kawasaki, JP;
Inventor:
Hiroki Kogawa, Matsumoto, JP;
Assignee:
FUJI ELECTRIC CO., LTD., Kawasaki, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/10 (2006.01); H05K 1/18 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
H05K 1/181 (2013.01); H05K 1/0306 (2013.01); H05K 3/102 (2013.01); H05K 2201/0209 (2013.01);
Abstract
A semiconductor device, including an insulated circuit board that has a radiation plate, a resin board adhered to a front surface of the radiation plate, and a circuit pattern adhered to a front surface of the resin board. The resin board contains a resin. The semiconductor device further includes a wiring member, and at least one semiconductor chip, bonded to the front surface of the circuit pattern or electrically connected to the wiring member. The circuit pattern has at least one pair of side portions opposite to each other that are supported by the resin board.