The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 16, 2021

Filed:

Nov. 20, 2020
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;

Inventors:

Jung Hyun Cho, Suwon-si, KR;

Kyung Hwan Ko, Suwon-si, KR;

Chi Won Hwang, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 3/40 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 1/115 (2013.01); H05K 1/111 (2013.01); H05K 1/181 (2013.01); H05K 3/4007 (2013.01); H05K 3/4038 (2013.01); H05K 2201/095 (2013.01); H05K 2201/09827 (2013.01);
Abstract

A printed circuit board includes a printed circuit board includes a substrate portion having a recess portion and including a first circuit layer, abridge disposed in the recess portion and including an insulating layer and a bridge circuit layer, an insulating material disposed in at least a portion of the recess portion and covering at least a portion of the bridge, a second circuit layer disposed on the insulating material, and a first via penetrating through the insulating material and a portion of the bridge and connecting the second circuit layer and the bridge circuit layer to each other.


Find Patent Forward Citations

Cho, Jung. (2021). Printed circuit board and method of manufacturing the same (U.S. Patent No. 11178761). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11178761

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…