The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 16, 2021
Filed:
Nov. 21, 2017
Sony Semiconductor Solutions Corporation, Kanagawa, JP;
Ryo Itotani, Kanagawa, JP;
Yuta Momiuchi, Kanagawa, JP;
Hirokazu Nakayama, Kanagawa, JP;
Tooru Kai, Oita, JP;
Miyoshi Togawa, Oita, JP;
SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa, JP;
Abstract
To enhance reliability of an electronic component. There is provided an electronic component including a base material having a first face and a second face, a first layer provided on the first face of the base material and including a plurality of pads connected to a plurality of bumps of a chip flip-chip mounted on the first face of the base material, respectively, and a second layer provided on the second face of the base material, in which a contacting member arranged at apart contacting with the second face of the base material at a position corresponding to each of the plurality of pads in the second layer is made of the same material.