The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 16, 2021
Filed:
Jul. 06, 2018
Applicant:
International Business Machines Corporation, Armonk, NY (US);
Inventors:
Bruce J. Chamberlin, Vestal, NY (US);
Matthew S. Kelly, Oakville, CA;
Scott B. King, Rochester, MN (US);
Joseph Kuczynski, North Port, FL (US);
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2006.01); H05K 1/09 (2006.01); H05K 1/11 (2006.01); H05K 3/42 (2006.01); H05K 3/46 (2006.01); H05K 3/00 (2006.01); H05K 1/02 (2006.01); H05K 1/14 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0366 (2013.01); H05K 1/0373 (2013.01); H05K 1/09 (2013.01); H05K 1/11 (2013.01); H05K 1/115 (2013.01); H05K 3/0014 (2013.01); H05K 3/429 (2013.01); H05K 3/4664 (2013.01); H05K 1/0284 (2013.01); H05K 1/14 (2013.01); H05K 2203/0278 (2013.01); H05K 2203/1453 (2013.01);
Abstract
A process of manufacturing a multiple-layer printed circuit board includes selectively applying a dielectric resin to a region of a circuitized core layer. The process also includes partially curing the dielectric resin prior to performing a lamination cycle to form the multiple-layer printed circuit board that includes the circuitized core layer.