The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 16, 2021

Filed:

Mar. 16, 2018
Applicant:

Dell Products, Lp, Round Rock, TX (US);

Inventors:

Vijendera Kumar, Bangalore, IN;

Sanjay Kumar, Ranchi, IN;

Arun R. Chada, Round Rock, TX (US);

Mallikarjun Vasa, Secunderabad, IN;

Bhyrav M. Mutnury, Austin, TX (US);

Assignee:

Dell Products L.P., Round Rock, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); G06F 13/42 (2006.01); H05K 3/40 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0245 (2013.01); G06F 13/4282 (2013.01); H05K 1/115 (2013.01); H05K 3/4038 (2013.01); G06F 2213/0026 (2013.01); G06F 2213/0032 (2013.01); G06F 2213/0042 (2013.01); H05K 2201/09609 (2013.01);
Abstract

A printed circuit board includes a differential signal via pairs to route differential signal between layers of the printed circuit board. A first differential signal via pair is oriented in a first orientation and a second differential signal via pair is oriented perpendicular to the first orientation. The second differential signal via pair is located such that a midpoint of a first line segment drawn between centers of first and second vias of the second differential signal pair intersects a first ray drawn from a center of a first via of the first differential signal via pair through a center of a second via of the first differential signal via pair. Further, the second differential signal via pair is located such that the midpoint of the first line segment is at a characteristic via-to-via pitch distance for the printed circuit board from the center of the second via of the first differential signal via pair.


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