The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 16, 2021

Filed:

May. 10, 2016
Applicant:

Sony Mobile Communications Inc., Tokyo, JP;

Inventor:

Zhinong Ying, Lund, SE;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01Q 9/04 (2006.01); H01Q 21/28 (2006.01); H01Q 21/30 (2006.01); H01Q 9/28 (2006.01);
U.S. Cl.
CPC ...
H01Q 9/0421 (2013.01); H01Q 9/0457 (2013.01); H01Q 9/285 (2013.01); H01Q 21/28 (2013.01); H01Q 21/30 (2013.01);
Abstract

C-fed antenna formed on multi-layer printed circuit board edge A patch antenna () comprises an antenna patch () and a feeding patch () configured for capacitive feeding of the antenna patch (). The antenna patch () is formed of multiple conductive strips () extending in a horizontal direction along an edge of a multi-layer printed circuit board (PCB). The multi-layer PCB has multiple layers stacked along a vertical direction. Each of the conductive strips () of the antenna patch () is arranged on a different layer of the multi-layer PCB. The conductive strips () are electrically connected to each other by conductive vias () extending between two or more of the conductive strips () of the antenna patch (). The feeding patch () is formed of multiple conductive strips () extending in the horizontal direction. Each of the conductive strips () of the feeding patch () is arranged on a different layer of the multilayer PCB. The conductive strips () of the feeding patch are electrically connected to each other by conductive vias () extending between two or more of the conductive strips () of the feeding patch ().


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