The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 16, 2021
Filed:
Nov. 06, 2018
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
Assignee:
SAMSUNG ELECTRONICS CO., LTD., Gyeonggi-Do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/22 (2006.01); H01Q 1/48 (2006.01); H01Q 21/06 (2006.01); H01Q 9/04 (2006.01); H01Q 25/00 (2006.01); H01Q 3/34 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/2283 (2013.01); H01Q 1/48 (2013.01); H01Q 9/045 (2013.01); H01Q 9/0414 (2013.01); H01Q 21/061 (2013.01); H01Q 3/34 (2013.01); H01Q 21/065 (2013.01); H01Q 25/001 (2013.01);
Abstract
A radio frequency (RF) device may include a radio frequency integrated circuit (RFIC) chip and an antenna module on an upper surface of the RFIC chip. The antenna module may include a first patch parallel to the RFIC chip and having an upper surface configured to emit radiation in a vertical direction opposite the first patch from the RFIC chip, a ground plate parallel to the first patch, and between the first patch and the RFIC chip, and a first plurality of feed lines connected to a lower surface of the first patch and configured to supply at least one first differential signal to the first patch from the RFIC chip.