The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 16, 2021

Filed:

Apr. 22, 2019
Applicant:

Beijing Apollo Ding Rong Solar Technology Co., Ltd., Beijing, CN;

Inventors:

Thomas Heckel, Mountain View, CA (US);

Heinrich von Bunau, San Jose, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C23C 14/56 (2006.01); C23C 14/54 (2006.01); H01L 31/18 (2006.01); H01L 31/032 (2006.01); C23C 14/34 (2006.01); H01J 37/34 (2006.01); H01L 31/0749 (2012.01);
U.S. Cl.
CPC ...
H01L 31/18 (2013.01); C23C 14/34 (2013.01); C23C 14/541 (2013.01); C23C 14/568 (2013.01); H01J 37/3488 (2013.01); H01L 31/0322 (2013.01); H01J 2237/204 (2013.01); H01L 31/0749 (2013.01);
Abstract

A sputter deposition method includes sputtering a first target material onto a web substrate moving through a first process module while heating the substrate, providing the substrate from the first process module to a connection unit containing a roller assembly including a plurality of cylindrical rollers, bending the substrate at an angle of 10° to 40° around the roller assembly in the connection unit, providing the substrate from the connection unit to a second process module, and sputtering a second target material onto the substrate moving through the second process module while heating the substrate.


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