The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 16, 2021

Filed:

Oct. 25, 2017
Applicant:

Semiconductor Energy Laboratory Co., Ltd., Atsugi, JP;

Inventors:

Masahiro Katayama, Tochigi, JP;

Masayoshi Dobashi, Shimotsuga, JP;

Masataka Nakada, Tochigi, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/66 (2006.01); H01L 29/786 (2006.01); H01L 51/00 (2006.01); H01L 27/12 (2006.01); H01L 27/32 (2006.01);
U.S. Cl.
CPC ...
H01L 29/66969 (2013.01); H01L 27/1225 (2013.01); H01L 27/1248 (2013.01); H01L 27/1266 (2013.01); H01L 27/1288 (2013.01); H01L 27/32 (2013.01); H01L 29/7869 (2013.01); H01L 29/78633 (2013.01); H01L 51/003 (2013.01); H01L 27/3232 (2013.01); H01L 27/3244 (2013.01); H01L 51/0097 (2013.01); H01L 2227/323 (2013.01); H01L 2251/303 (2013.01); H01L 2251/566 (2013.01);
Abstract

A semiconductor device is manufactured with high mass productivity at low cost. Yield in a manufacturing process of the semiconductor device is improved. An island-shaped metal oxide layer is formed over a substrate, a resin layer is formed over the metal oxide layer to cover an end portion of the metal oxide layer, and the metal oxide layer and the resin layer are separated by light irradiation. After forming the resin layer and before the light irradiation, an insulating layer is formed over the resin layer. For example, the resin layer is formed in an island shape and the insulating layer is formed to cover an end portion of the resin layer. In the case where an adhesive layer is formed over the resin layer, the adhesive layer is preferably formed to be located inward from the end portion of the metal oxide layer.


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