The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 16, 2021
Filed:
Dec. 31, 2019
Applicant:
Renesas Electronics Corporation, Tokyo, JP;
Inventor:
Ryuichi Oikawa, Tokyo, JP;
Assignee:
RENESAS ELECTRONICS CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/552 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/46 (2013.01); H01L 23/481 (2013.01); H01L 23/552 (2013.01); H01L 24/13 (2013.01);
Abstract
The semiconductor device includes a solder ball connected to a pad, and located below the pad, a first wiring electrically connected to the pad, and located above the pad, and a second wiring electrically connected to the first wiring. At this time, a width of the first wiring is greater than a width of the second wiring. Accordingly, high-frequency noise can be reduced while improving signal transmission characteristics.