The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 16, 2021
Filed:
Apr. 02, 2020
Applicant:
Synaptics Incorporated, San Jose, CA (US);
Inventors:
Naoki Hasegawa, Tokyo, JP;
Shinya Suzuki, Tokyo, JP;
Hiromasa Hiura, Tokyo, JP;
Yuichi Nakagomi, Tokyo, JP;
Assignee:
Synaptics Incorporated, San Jose, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/13 (2013.01); H01L 24/05 (2013.01); H01L 2924/15311 (2013.01);
Abstract
An integrated circuit (IC) chip comprises a plurality of pads and a plurality of bumps. The plurality of pads includes a first pad. The plurality of bumps is disposed on the plurality of pads. The plurality of bumps includes a first bump disposed on the first pad. The first bump as a width that is different than an exposed with of the first pad. The center of the first bump is not aligned with a center of the first pad.