The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 16, 2021

Filed:

Mar. 31, 2020
Applicant:

Fuji Electric Co., Ltd., Kawasaki, JP;

Inventors:

Toshio Denta, Matsumoto, JP;

Yuji Ichimura, Matsumoto, JP;

Assignee:

FUJI ELECTRIC CO., LTD., Kawasaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 25/07 (2006.01); H01L 25/18 (2006.01); H01L 23/057 (2006.01); H01L 21/48 (2006.01); H01L 25/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/564 (2013.01); H01L 21/4817 (2013.01); H01L 23/057 (2013.01); H01L 24/48 (2013.01); H01L 24/85 (2013.01); H01L 25/072 (2013.01); H01L 25/18 (2013.01); H01L 25/50 (2013.01); H01L 2224/48139 (2013.01); H01L 2224/85205 (2013.01); H01L 2924/12032 (2013.01); H01L 2924/12036 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01);
Abstract

A flat plate frame is formed, which is flat plate-shaped, which has an opening penetrating its front and rear surfaces and groove terminal patterns formed on its front surface, and which contains a semi-cured thermosetting resin. Then, an insulating substrate is disposed on the rear surface so as to cover the opening of the flat plate frame, external connection terminals are disposed on the terminal patterns, and heating is carried out. As a result, a terminal package to which the insulating substrate and external connection terminals are firmly joined is produced using the flat plate frame. The external connection terminals included in the terminal package are reliably and firmly joined to the terminal package. Therefore, the external connection terminals are not displaced when wires are bonded to the external connection terminals.


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