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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11177189 B1

PDFFull Text
Date of Patent:
Nov. 16, 2021

Filed:

Sep. 25, 2019

Module including heat dissipation structure

Applicant:

Murata Manufacturing Co., Ltd., Kyoto, JP;

Inventors:

Yoshihito Otsubo, Kyoto, JP;

Yoshitaka Matsukawa, Kyoto, JP;

Assignee:

MURATA MANUFACTURING CO., LTD., Kyoto, JP;

Attorney:

Pearne & Gordon LLP

Primary Examiner:

Herve-Louis Y Assouman

Int. Cl.
CPC ...
H01L 23/367 (2006.01); H01L 23/31 (2006.01); H01L 23/538 (2006.01); H01L 21/56 (2006.01); H01L 23/433 (2006.01); H01L 23/36 (2006.01); H01L 25/04 (2014.01); H01L 25/18 (2006.01); H01L 23/552 (2006.01); H01L 25/065 (2006.01); H01L 21/48 (2006.01); H01L 21/78 (2006.01); H01L 23/00 (2006.01); H01L 25/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3675 (2013.01); H01L 23/315 (2013.01); H01L 23/3121 (2013.01); H01L 23/5383 (2013.01); H01L 23/5386 (2013.01); H01L 23/552 (2013.01); H01L 25/0655 (2013.01); H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 21/561 (2013.01); H01L 21/565 (2013.01); H01L 21/78 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H01L 24/97 (2013.01); H01L 25/50 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16235 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/81815 (2013.01); H01L 2924/3025 (2013.01);
Abstract

A module includes a substrate, a first component on a first main surface of the substrate and from which heat is to be dissipated, a sealing resin layer that encloses the first component, and a heat-dissipating member that includes a first and a second heat-dissipating portions. The first heat-dissipating portion is disposed in the sealing resin layer, spaced apart from an upper surfaces of the first component, and includes a first overlap portion that overlaps an upper surfaces of the first component when viewed in plan in a direction perpendicular to the first main surface. The second heat-dissipating portion extends from an undersurface of the first overlap portion to the upper surface of the first component. An area of the second heat-dissipating portion on a surface of the first overlap portion including the undersurface is smaller than an area of the first overlap portion.

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