logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11177164 B1

PDFFull Text
Date of Patent:
Nov. 16, 2021

Filed:

Aug. 06, 2018

Self-aligned high aspect ratio structures and methods of making

Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Susmit Singha Roy, Sunnyvale, CA (US);

Praburam Gopalraja, Santa Clara, CA (US);

Abhijit Basu Mallick, Palo Alto, CA (US);

Srinivas Gandikota, Santa Clara, CA (US);

Assignee:

APPLIED MATERIALS, INC., Santa Clara, CA (US);

Attorney:

Servilla Whitney LLC

Primary Examiner:

Bradley Smith

Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 21/768 (2006.01); H01L 21/285 (2006.01); H01L 21/3105 (2006.01); H01L 21/311 (2006.01); H01L 21/321 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76816 (2013.01); H01L 21/02175 (2013.01); H01L 21/02244 (2013.01); H01L 21/28568 (2013.01); H01L 21/31053 (2013.01); H01L 21/31111 (2013.01); H01L 21/3212 (2013.01); H01L 21/7684 (2013.01); H01L 21/76834 (2013.01); H01L 21/76877 (2013.01); H01L 21/76888 (2013.01); H01L 21/76897 (2013.01);
Abstract

Processing methods to form self-aligned high aspect ratio features are described. The methods comprise depositing a metal film on a structured substrate, volumetrically expanding the metal film, depositing a second film between the expanded pillars and optionally recessing the pillars and repeating the process to form the high aspect ratio features.

Find Patent Forward Citations

Roy, Susmit. (2021). Self-aligned high aspect ratio structures and methods of making (U.S. Patent No. 11177164). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11177164

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…