The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 16, 2021
Filed:
Aug. 06, 2018
Applicant:
Applied Materials, Inc., Santa Clara, CA (US);
Inventors:
Susmit Singha Roy, Sunnyvale, CA (US);
Praburam Gopalraja, Santa Clara, CA (US);
Abhijit Basu Mallick, Palo Alto, CA (US);
Srinivas Gandikota, Santa Clara, CA (US);
Assignee:
APPLIED MATERIALS, INC., Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 21/768 (2006.01); H01L 21/285 (2006.01); H01L 21/3105 (2006.01); H01L 21/311 (2006.01); H01L 21/321 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76816 (2013.01); H01L 21/02175 (2013.01); H01L 21/02244 (2013.01); H01L 21/28568 (2013.01); H01L 21/31053 (2013.01); H01L 21/31111 (2013.01); H01L 21/3212 (2013.01); H01L 21/7684 (2013.01); H01L 21/76834 (2013.01); H01L 21/76877 (2013.01); H01L 21/76888 (2013.01); H01L 21/76897 (2013.01);
Abstract
Processing methods to form self-aligned high aspect ratio features are described. The methods comprise depositing a metal film on a structured substrate, volumetrically expanding the metal film, depositing a second film between the expanded pillars and optionally recessing the pillars and repeating the process to form the high aspect ratio features.