The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 16, 2021
Filed:
Sep. 06, 2019
Applicant:
Toshiba Memory Corporation, Tokyo, JP;
Inventors:
Norikatsu Sasao, Kawasaki Kanagawa, JP;
Koji Asakawa, Kawasaki Kanagawa, JP;
Shinobu Sugimura, Yokohama Kanagawa, JP;
Assignee:
TOSHIBA MEMORY CORPORATION, Tokyo, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/027 (2006.01); H01L 21/02 (2006.01); H01L 21/3105 (2006.01); H01L 21/311 (2006.01); C08F 220/44 (2006.01); H01L 27/11556 (2017.01); H01L 27/11582 (2017.01);
U.S. Cl.
CPC ...
H01L 21/0271 (2013.01); C08F 220/44 (2013.01); H01L 21/02118 (2013.01); H01L 21/02282 (2013.01); H01L 21/31058 (2013.01); H01L 21/31116 (2013.01); H01L 21/31144 (2013.01); C08F 2800/20 (2013.01); C08F 2810/00 (2013.01); H01L 27/11556 (2013.01); H01L 27/11582 (2013.01);
Abstract
According to one embodiment, a method of manufacturing a semiconductor device is disclosed. The method of manufacturing a semiconductor device, includes forming an organic film containing polyacrylonitrile on a target film on a semiconductor substrate; applying a metal compound to the organic film to form a composite film; removing the composite film partially to form a pattern; heating the pattern-formed composite film; and processing the target film by using the heated composite film as a mask.