The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 16, 2021
Filed:
Dec. 20, 2016
Applicant:
Fujifilm Electronic Materials U.s.a., Inc., N. Kingstown, RI (US);
Inventors:
Sanjay Malik, Attleboro, MA (US);
Raj Sakamuri, Sharon, MA (US);
Ognian N. Dimov, Warwick, RI (US);
Binod B. De, Attleboro, MA (US);
William A. Reinerth, Riverside, RI (US);
Ahmad A. Naiini, East Greenwich, RI (US);
Assignee:
Fujifilm Electronic Materials U.S.A., Inc., N. Kingstown, RI (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/095 (2006.01); C09D 179/08 (2006.01); G03F 7/033 (2006.01); G03F 7/037 (2006.01); G03F 7/075 (2006.01); G03F 7/32 (2006.01); C09D 133/10 (2006.01); C08G 73/10 (2006.01); H01L 21/311 (2006.01); G03F 7/027 (2006.01);
U.S. Cl.
CPC ...
G03F 7/095 (2013.01); C08G 73/1014 (2013.01); C08G 73/1039 (2013.01); C08G 73/1067 (2013.01); C09D 133/10 (2013.01); C09D 179/08 (2013.01); G03F 7/027 (2013.01); G03F 7/033 (2013.01); G03F 7/037 (2013.01); G03F 7/0755 (2013.01); G03F 7/325 (2013.01); H01L 21/311 (2013.01);
Abstract
This disclosure relates to a photosensitive stacked structure that includes first and second layers, in which the first layer is a photosensitive, dielectric layer and the second layer is a photosensitive layer. The dissolution rate of the first layer in a developer is less than the dissolution rate of the second layer in the developer.