The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 16, 2021

Filed:

Mar. 16, 2020
Applicant:

Facebook Technologies, Llc, Menlo Park, CA (US);

Inventors:

Matthew E. Colburn, Woodinville, WA (US);

Giuseppe Calafiore, Redmond, WA (US);

Matthieu Charles Raoul Leibovici, Seattle, WA (US);

Nihar Ranjan Mohanty, Redmond, WA (US);

Assignee:

Facebook Technologies, LLC, Menlo Park, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/124 (2006.01); G02B 6/34 (2006.01); G02B 5/18 (2006.01); G02B 27/42 (2006.01); H01J 37/305 (2006.01); G02B 27/01 (2006.01); H01L 21/027 (2006.01); G02B 6/12 (2006.01);
U.S. Cl.
CPC ...
G02B 6/124 (2013.01); G02B 5/1857 (2013.01); G02B 5/1861 (2013.01); G02B 27/0172 (2013.01); G02B 27/42 (2013.01); H01J 37/3056 (2013.01); H01L 21/0274 (2013.01); G02B 2006/12107 (2013.01); H01J 2237/0812 (2013.01);
Abstract

A manufacturing system performs a deposition of an etch-compatible film over a substrate. The etch-compatible film includes a first surface and a second surface opposite to the first surface. The manufacturing system performs a partial removal of the etch-compatible film to create a surface profile on the first surface with a plurality of etch heights relative to the substrate. The manufacturing system performs a lithographic patterning of a photoresist deposited over the created profile in the etch-compatible film to obtain the plurality of etch heights and one or more duty cycles corresponding to the etch-compatible film deposited over the substrate.


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