The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 16, 2021
Filed:
Mar. 12, 2018
Jx Nippon Mining & Metals Corporation, Tokyo, JP;
Kenta Tsujie, Kanagawa, JP;
JX Nippon Mining & Metals Corporation, Tokyo, JP;
Abstract
A titanium copper according to the present invention contains from 1.5 to 5.0% by mass of Ti, the balance being of Cu and inevitable impurities, wherein the titanium copper has a layered structure of Cu and Ti where in a Ti concentration curve obtained by analyzing a cross section parallel to a rolling direction along a thickness direction by STEM-EDX, a lower concentration Ti layer having a Ti concentration less than an average value of Ti concentrations in the Ti concentration curve and a higher concentration Ti layer having a Ti concentration equal to or higher than the average value of the Ti concentrations in the Ti concentration curve are alternately present in the thickness direction, and wherein in the cross section parallel to the rolling direction, a Ti concentration difference in the layered structure is 3% by mass or more, the Ti concentration difference being a difference between a maximum value of the Ti concentration in the higher concentration Ti layer and a minimum value of the Ti concentration in the lower concentration Ti layer.