The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 16, 2021

Filed:

Oct. 31, 2016
Applicant:

Nitto Denko Corporation, Osaka, JP;

Inventors:

Akiko Yoshida, Osaka, JP;

Kenichi Okada, Osaka, JP;

Koji Akazawa, Osaka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 5/04 (2006.01); C09J 163/00 (2006.01); C09J 7/30 (2018.01); C09J 7/10 (2018.01); C09J 7/40 (2018.01); C09J 11/06 (2006.01);
U.S. Cl.
CPC ...
C09J 5/04 (2013.01); C09J 7/10 (2018.01); C09J 7/30 (2018.01); C09J 7/403 (2018.01); C09J 7/405 (2018.01); C09J 163/00 (2013.01); C09J 11/06 (2013.01); C09J 2463/00 (2013.01);
Abstract

An adhesion method including: a step (1), disposing a stickable-curable adhesive layer on a first adherend; a step (2), disposing a curing agent layer on a second adherend, the curing agent layer being able to cure the stickable-curable adhesive layer by contacting and reacting with the stickable-curable adhesive layer; and a step (3), bringing the stickable-curable adhesive layer into contact with the curing agent layer so that they are sandwiched by the first adherend and the second adherend.


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