The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 16, 2021

Filed:

Dec. 17, 2019
Applicant:

Elite Electronic Material (Kunshan) Co., Ltd., Kunshan, CN;

Inventors:

Chenyu Shen, Kunshan, CN;

Yan Zhang, Kunshan, CN;

Jue Tan, Kunshan, CN;

Rongtao Wang, Kunshan, CN;

Chen-Yu Hsieh, Taoyuan, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 71/12 (2006.01); C08L 57/00 (2006.01); C08K 3/22 (2006.01); C08K 3/36 (2006.01); C08J 5/24 (2006.01); C08L 47/00 (2006.01);
U.S. Cl.
CPC ...
C08L 71/126 (2013.01); C08J 5/24 (2013.01); C08K 3/22 (2013.01); C08K 3/36 (2013.01); C08L 47/00 (2013.01); C08L 57/00 (2013.01); C08K 2003/222 (2013.01); C08K 2201/003 (2013.01); C08L 2203/16 (2013.01); C08L 2203/20 (2013.01); C08L 2205/03 (2013.01);
Abstract

A resin composition includes: (A) a vinyl-containing polyphenylene ether resin; (B) a resin of Formula (1); and (C) an inorganic filler. Moreover, also provided is an article made from the resin composition described above, which comprises a prepreg, a resin film, a laminate or a printed circuit board, wherein the article achieves improvement in at least one of the following properties: dissipation factor, comparative tracking index, X-axis thermal expansion coefficient, and temperature coefficient of dielectric constant.


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