The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 16, 2021

Filed:

Sep. 28, 2018
Applicant:

Sekisui Chemical Co., Ltd., Osaka, JP;

Inventors:

Koji Yachi, Shiraoka, JP;

Hiroshi Hiraike, Hasuda, JP;

Yuuki Hoshiyama, Shiraoka, JP;

Izumi Okamura, Takatsuki, JP;

Yasuharu Nagai, Takatsuki, JP;

Kazuyuki Yahara, Nagaokakyo, JP;

Ayaha Oguri, Takatsuki, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08J 9/22 (2006.01); C08F 20/18 (2006.01); C08F 220/12 (2006.01); C08J 9/232 (2006.01);
U.S. Cl.
CPC ...
C08F 220/12 (2013.01); C08J 9/232 (2013.01); C08J 2203/22 (2013.01); C08J 2333/08 (2013.01);
Abstract

A shock-absorbing sheet comprises a foamed resin layer having a thickness of 200 μm or less, a void ratio (P) of a plane directional cross section at a thickness of 0.1 T, a void ratio (P) of a plane directional cross section at a thickness of 0.5 T, and a void ratio (P) of a plane directional cross section at a thickness of 0.9 T from one surface of the foamed resin layer each ranging from 10 to 70 area %; and the standard deviation (Pσ) for an average void ratio found from the void ratio (P), the void ratio (P) and the void ratio (P) ranging from 1.0 to 20.


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