The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 16, 2021
Filed:
May. 16, 2019
Ddp Specialty Electronic Materials Us, Llc, Wilmington, DE (US);
Andreas Lutz, Freienbach, CH;
Daniel Schneider, Freienbach, CH;
Irene Maeder, Freienbach, CH;
Marcel Aschwanden, Freienbach, CH;
Michael Ras, Horgen, CH;
DDP SPECIALTY ELECTRONIC MATERIALS US, LLC, Wilmington, DE (US);
Abstract
Adhesive bonds are applied by mixing two adhesives with different properties and dispensing them to form bondlines between substrate pairs. The adhesives are then thermally cured and cooled. Varying the mix ratio permits one to vary the properties of the adhesive mixture so formed for use in bonding many different substrate pairs. The process allows potentially infinite variations of adhesive properties between those of the respective starting adhesives, simply by varying the mix ratio. The invention is especially adapted for use in manufacturing settings in which adhesives are to be applied in multiple places, but differing adhesive properties are needed among the various bonding areas.