The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 16, 2021

Filed:

Apr. 13, 2018
Applicant:

Illinois Tool Works Inc., Glenview, IL (US);

Inventor:

Ning Yang, Suzhou, CN;

Assignee:

Illinois Tool Works Inc., Glenview, IL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 1/00 (2006.01); B23K 3/06 (2006.01); H05K 3/34 (2006.01); H05K 3/12 (2006.01); B23K 101/42 (2006.01);
U.S. Cl.
CPC ...
B23K 3/0623 (2013.01); B23K 1/0016 (2013.01); B23K 3/0638 (2013.01); H05K 3/1233 (2013.01); H05K 3/3485 (2020.08); B23K 2101/42 (2018.08);
Abstract

The present application provides a method for providing solder paste, for providing solder paste accommodated in a solder paste tub into a solder paste printer, the method comprising: inserting a solder paste nozzle into a housing of the solder paste tub through an opening of the solder paste tub, wherein solder paste is accommodated in the housing of the solder paste tub; bearing the solder paste tub, with the opening facing downward, on a working platform by means of the solder paste nozzle; holding the solder paste tub by mating a holder with an engagement means on an outer wall of the housing of the solder paste tub, the holder being capable of moving up and down with the housing of the solder paste tub; and pressing the housing of the solder paste tub, such that the housing of the solder paste tub moves relative to the solder paste nozzle, at the same time causing the holder to move as the housing of the solder paste tub moves, so as to extrude solder paste accommodated in the housing of the solder paste tub from the solder paste nozzle.


Find Patent Forward Citations

Yang, Ning. (2021). Solder paste feeding assembly and method (U.S. Patent No. 11173562). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11173562

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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