The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 09, 2021

Filed:

Oct. 01, 2019
Applicants:

Toyo Ink SC Holdings Co., Ltd., Tokyo, JP;

Toyochem Co., Ltd., Tokyo, JP;

Inventors:

Shota Mori, Chuo-ku, JP;

Kazunori Matsudo, Chuo-ku, JP;

Kenji Ando, Chuo-ku, JP;

Tsutomu Hayasaka, Chuo-ku, JP;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 9/00 (2006.01); H01L 23/552 (2006.01);
U.S. Cl.
CPC ...
H05K 9/0088 (2013.01); H01L 23/552 (2013.01); H05K 9/0071 (2013.01); H05K 9/0092 (2013.01);
Abstract

An electromagnetic-wave shielding sheet is an electromagnetic-wave shielding sheet used to form an electronic component-mounted substrate, the electronic component-mounted substrate including an electromagnetic-wave shielding layer covering at least a part of a step part and an exposed surface of a substrate, in which the electromagnetic-wave shielding sheet is a laminate including a cushion layer and a conductive layer, the conductive layer is an isotropic conductive layer containing a binder resin and a conductive filler, a thickness of the conductive layer is 8 to 70 μm, and a content of the conductive filler in a region on a side opposite to a cushion layer side in the conductive layer is larger than that in a region on the cushion layer side in the conductive layer.


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