The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 09, 2021
Filed:
Feb. 18, 2020
Applicant:
Asustek Computer Inc., Taipei, TW;
Inventors:
Chun-Chieh Wong, Taipei, TW;
Cheng-Yu Wang, Taipei, TW;
Assignee:
ASUSTEK COMPUTER INC., Taipei, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H01L 23/42 (2006.01); G06F 1/20 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20454 (2013.01); H01L 23/42 (2013.01); H05K 7/20336 (2013.01); G06F 1/20 (2013.01);
Abstract
A heat dissipation structure applied to a substrate with a heat generating element is provided. The heat dissipation structure includes a heat dissipation body and an elastomer. The heat dissipation body includes a connecting portion, where the connecting portion includes a central area and a peripheral area, and the central area is configured to contact with the heat generating element. The elastomer is disposed between the peripheral area and the heat generating element, to form a sealed space, and the sealed space is configured to accommodate a heat-conducting medium.